PRODUCTS

Heron 80 Barrel

 

 

 

Heron 80 is a stand alone plasma system, designed for surface cleaning, modification, activation and etching.

It can operate on different materials such as metals, plastic, ceramic, paper and others.

The user friendly graphical interface combined with the efficient RF system makes Heron 80 an easy and versatile solution for small productions or R&D environments.

 

Semiconductors

• Photoresist stripping and descumming.
• Isotropic removal of organic polymers
• Isotropic removal of silicon oxides/nitrides
• Cleaning before wire bonding (both on bond pads and chip carriers)

 

Solar (PV)

• Possibility to process single cells or batches (rounded or squared up to 156 mm square)
• Isotropic removal of silicon nitride for isolation of  cell edges
• Isotropic removal of amorphous and multi-crystalline silicon
• Surface texturization of mono and multi-crystalline silicon for reflectivity reduction and efficiency enhancement.

 

Biomedical

• Surface cleaning and modification for wettability and unwettability purposes, for the following applications :
• Selective filtration of biologic  fluids
• Implant devices
• Bonding among different materials (like syringe needles, catheters, etc.)
• Final ultrafine  atomic level cleaning from organic residues  after typical industrial cleaning cycles
• Contact and intraocular lenses
• Stents
• Vials
• Sterilization on sensible plastic materials

 

Textile Industry

•  Cleaning and surface modification, in order to obtain hydrophilic  surfaces before staining or printing on natural or synthetic fibers.
•  Only for R&D purpose, not for massive production

 

NanoBiotec

• Selective grafting of cells (petri dishes etc.) for cell culture
• Films polymerization
• Surface activation for SAM’s (self assembled monolayers) growing
• Wettability of microfluidic channels

 

Plastic Industry

• Surface cleaning and modification for wettability and unwettability purposes, for the following applications :
• Plastics bonding  to plastics or other  materials
• Surface activation before painting , with possibility to eliminate the usage of Primers
• Wettability before printing
• Removal of organic residues after molding before painting/printing
• Surface fluorination for enhanced functionality
• Crosslinking
• Surface polimerization

 

Precision mechanics

 Cleaning at the atomic level of metal and ceramic surfaces after industrial washing to improve paintability or other types of coatings (eg PVD).

 

Optical and ophthalmic

 Cleaning at the atomic level and pre-treatment after industrial washing  to improve the adhesion of coatings anti-glare, scratch-resistant and various; polymerization of layers scratch and anti-fog.

 

Cultural heritage

 Antibacterial and fungicide treatments for the recovery and preservation of old books and antique glass.

 

Product features

●  Low cost of ownership ●  The touch screen display provides in real-time all the main information for excellent process control and rapid analysis ●  Able to process up to ten different editable recipes ●  Uniformity for Consistent Results ●  Datalogging capabilities, frequency <0,5 Hz, for historical condition of the process ●  Excellent process control and long term reliability and stability ●  Primary brands components used, such as vacuum gauges and mass flow controllers (MKS Instruments) ●  RF power level adjustable in the range 1W to 600W

 

Technical specification
Dimensions	W x L x H – Footprint	700 x 600 x 1750 mm
	Net Weight	130 Kg
	ClearancesDistanze di rispetto	Right, Left, Front – 600 mm, Back – 254 mm
Chamber	Material	Aluminum
	Max Volume	22.5 lt. (1373 in³) - Ø 343 mm L 280 mm
Electrode	Material	Aluminum
	Active work area/samle tray	239L x 250P mm
	Height	168 mm
RF Signal	Max Power	600W
	Frequency	13,56 MHz
Process gases	Available flows	10, 20, 50, 100, 200 or 500 sccm
	Max gases lines	3 (Mass Flow Controller from MKS Instruments)
Control interface	Control	PLC
	User Interface	Touch Screen Display
Facility Service	Power Supply	Three-phase + N + Earth 380/415 VAC, 32 Amax 50/60 Hz, 7 AWG Three-phase + N + Earth 208/240 VAC, 40 Amax, 50/60 Hz, 5 AWG
	Process gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Process gas pressure	from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
	Purge gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Suggested purge gas	N2, Air
	Purge gas pressure	from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
	Pneumatic Valve gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Pneumatic Valve gas purity	Compressed Air, Oil Free, Dew point ≤7°C (45°F), particulate dimensions <5 μm
	Pneumatic Valve gas pressure	From 2 bar (30 psig) min. to 6 bar (90 psig) max., regulated
	Exhaust	NW 40 ISO-KF
Compliance	International	CE Marked