The most recent vacuum plasma reactor developed by Gambetti Kenology is the FALCON RIE+.

This innovative system is designed to operate in two distinctive modes: anisotropic, with polarisation of the sample holder, or isotropic, with polarisation of the upper electrode.

The spacious chamber allows the insertion of samples with a maximum diameter of 8″. In addition, the use of a turbomolecular pump guarantees optimal directionality during the RIE process, while the 3-position gate valve ensures a wide range of process pressures.

Etching and Soft Etching

Discover the FALCON RIE+, the optimised solution for precision control in substrate and device preparation, essential in graphene and 2D materials research.

Exceptional Performance

Our system is equipped with:

  • 15.56 MHz and 200W RF generator, operating from <10W up to 200W with a minimum step of 1W.
  • Large 200 mm lower electrode.
  • Linear process gas flow (top to bottom) for accurate and uniform process control.

This allows a low W/cm² value to be maintained, which is ideal for delicate materials such as graphene and 2D materials.

Versatility and Accuracy

The FALCON RIE+ not only offers precise control, but also allows:

  • Cross-link-free modelling of common mask photoresists such as PMMA.
  • Use for traditional RIE applications, such as attachment to Silicon, Silicon Nitride etc.

Maximum Flexibility

Thanks to the possibility of alternating polarisation between the lower and upper electrodes, the FALCON RIE+ guarantees:

  • Maximum process flexibility.
  • Advanced applications such as cleaning and surface activation.

Full Range of Gases

The gases used in our system are:

  • N2
  • Ar
  • O2
  • SF6
  • CHF3

These gases ensure a wide range of processes, meeting almost any requirement.

Why Choose FALCON RIE+?

The FALCON RIE+ is the ideal solution for those seeking precision, flexibility and reliability in the processing of 2D materials and beyond. Contact us today to find out how we can support your research and production

Main applications:

  • Isotropic etching
  • Etching 2D materials
  • Removal of photoresist (stripping) and photoresist residue (descumming), a photosensitive polymer used in photolithographic masking processes.
  • Organic incineration, isotropic removal of organic polymers (e.g. polyamides, etc.) and Silicon Oxides/Nitrides.
  • Surface cleaning or modification prior to wire bonding (both bond pads and chip carriers).
  • reverse engineering applications (removal of passivants, decapsulation and delineation of cross sections)

Front view

Upper and lower electrode chamber

Side view

Open room

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