The Heron 80 plasma system is a reactor in a double-cage electrode configuration in which mainly chemical and isotropic etching processes take place. The plasma generated (using an RF source) gives rise to the creation of reactive ions.

The Heron 80 system is fully automated by means of a PLC that constantly monitors the status of the sensors, valves, flows, RF signal and pumping system. The only manual handling to be performed is the loading/unloading of samples.

This system is ideal for R&D or low- and medium-volume production, and is also designed to perform processes on substrates made of different materials such as metal, plastic, ceramics or paper.

Among the various treatments that can be implemented, the most significant are:


  • Removal of photoresist (stripping) and photoresist residue (descumming), a photosensitive polymer used in photolithographic masking processes.
  • Organic incineration, isotropic removal of organic polymers (e.g. polyamides, etc.) and Silicon Oxides/Nitrides.
  • Surface cleaning or modification prior to wire bonding (both bond pads and chip carriers).
  • Isotropic etching
  • reverse engineering applications (removal of passivants, decapsulation and delineation of cross sections)


Cleaning and surface modification to obtain hydrophilic or hydrophobic surfaces, which can be used for example in the following application areas:

  • Selective filtration of biologic fluids
  • Prosthetic implants (increased wettability for faster osseointegration)
  • Bonding between different materials (needles on syringes, catheters, etc.).
  • Final ultrafine atomic level cleaning from organic residues after typical industrial cleaning cycles
  • Contact and intraocular lenses
  • Stents
  • Vials
  • Sterilisation on heat-sensitive materials

Plastics industry

Cleaning and surface modifications that can be used in the following application areas, for example:

  • Plastics bonding to plastics or other materials
  • Surface activation before painting , with possibility to eliminate the usage of Primers
  • Wettability before printing
  • Removal of organic residues after molding before painting/printing
  • Surface fluorination for enhanced functionality
  • Fluoridation of surfaces to modify functional characteristics

Solar (PV)

  • Isotropic removal of silicon nitride for isolation of cell edges
  • Isotropic removal of amorphous and multi-crystalline silicon
  • Possibility to process single cells or batches (rounded or squared up to 156 mm square)
  • Surface texturization of mono and multi-crystalline silicon for reflectivity reduction and efficiency enhancement.

Textile industry

  • Cleaning and surface modification of natural and synthetic fibres to increase the hydrophilicity of fabrics prior to dyeing or printing;

Precision Mechanics

Atomic final cleaning of metal and ceramic surfaces after industrial washing to improve their paintability or for other types of coatings (e.g. PVD).

Optics and ophthalmics

Final cleaning at atomic level and pre-treatment after industrial washing to improve adhesion of anti-reflective, anti-scratch and similar coatings; curing of anti-scratch and anti-fog layers.

Product features

  • Low cost of ownership
  • The touch screen display provides in real-time all the main information for excellent process control and rapid analysis
  • Able to process up to ten different editable recipes
  • Uniformity for Consistent Results
  • Datalogging capabilities, frequency <0,5 Hz, for historical condition of the process
  • Excellent process control and long term reliability and stability
  • Primary brands components used, such as vacuum gauges and mass flow controllers (MKS Instruments)
  • RF power level adjustable in the range 1W to 600W
Technical Specifications
Dimensions L x P x A – Footprint 700 x 600 x 1750 mm
Net Weight 130 Kg
Respect distances Right, Left, Front – 600 mm, Retro – 254 mm
Chamber Material Aluminum
Max Volume 22.5 litri (1373 in³)
Electrode Material Aluminum
Active work area/samle tray 239L x 250P mm
Height 168 mm
RF Signal Max output Power 600W
Frequency 13,56 MHz
Process Gases Available flows 10, 20, 50, 100, 200 or 500 sccm
Max gases number 3 (Mass Flow Controller from MKS Instruments)
Control Interface Control PLC with Touch Screen Display
Remote control Under development
Facility Service Power supply Three-phase + N + Earth 380/415 VAC, 32 Amax 50/60 Hz, 7 AWG Three-phase + N + Earth 208/240 VAC, 40 Amax, 50/60 Hz, 5 AWG
Process Gas inlets, type and dimensions 6.35 mm (0.25 in.) OD Swagelok®
Process gas pressure from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
Purge Gas inlets, type and dimensions 6.35 mm (0.25 in.) OD Swagelok®
Suggested Purge Gas N2, Air
Purge Gas Pressure from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
Pneumatic Valve gas inlets, type and dimensions 6.35 mm (0.25 in.) OD Swagelok®
Pneumatic Valve gas purity Compressed Air, Oil Free, Dew point ≤7°C (45°F), particulate dimensions <5 μm
Pneumatic Valve gas pressure From 2 bar (30 psig) min. to 6 bar (90 psig) max., regulated
Exhaust NW 40 KF
Compliance International CE Marked

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