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PRODUCTS

Heron 80 Barrel

Proudly made in Italy

 

 

 

Heron 80 is a stand alone plasma system, designed for surface cleaning, modification, activation and etching.

It can operate on different materials such as metals, plastic, ceramic, paper and others.

The user friendly graphical interface combined with the efficient RF system makes Heron 80 an easy and versatile solution for small productions or R&D environments.

 

Semiconductors

  • Photoresist stripping and descumming.
  • Isotropic removal of organic polymers
  • Isotropic removal of silicon oxides/nitrides
  • Cleaning before wire bonding (both on bond pads and chip carriers)

 

Solar (PV)

  • Possibility to process single cells or batches (rounded or squared up to 156 mm square)
  • Isotropic removal of silicon nitride for isolation of  cell edges
  • Isotropic removal of amorphous and multi-crystalline silicon
  • Surface texturization of mono and multi-crystalline silicon for reflectivity reduction and efficiency enhancement.

 

Biomedical

  • Surface cleaning and modification for wettability and unwettability purposes, for the following applications :
  • Selective filtration of biologic  fluids
  • Implant devices
  • Bonding among different materials (like syringe needles, catheters, etc.)
  • Final ultrafine  atomic level cleaning from organic residues  after typical industrial cleaning cycles
  • Contact and intraocular lenses
  • Stents
  • Vials
  • Sterilization on sensible plastic materials

 

Textile Industry

  •  Cleaning and surface modification, in order to obtain hydrophilic  surfaces before staining or printing on natural or synthetic fibers.
  •  Only for R&D purpose, not for massive production

 

NanoBiotec

  • Selective grafting of cells (petri dishes etc.) for cell culture
  • Films polymerization
  • Surface activation for SAM’s (self assembled monolayers) growing
  • Wettability of microfluidic channels

 

Plastic Industry

  • Surface cleaning and modification for wettability and unwettability purposes, for the following applications :
  • Plastics bonding  to plastics or other  materials
  • Surface activation before painting , with possibility to eliminate the usage of Primers
  • Wettability before printing
  • Removal of organic residues after molding before painting/printing
  • Surface fluorination for enhanced functionality
  • Crosslinking
  • Surface polimerization

 

Precision mechanics

 Cleaning at the atomic level of metal and ceramic surfaces after industrial washing to improve paintability or other types of coatings (eg PVD).

 

Optical and ophthalmic

 Cleaning at the atomic level and pre-treatment after industrial washing  to improve the adhesion of coatings anti-glare, scratch-resistant and various; polymerization of layers scratch and anti-fog.

 

Cultural heritage

 Antibacterial and fungicide treatments for the recovery and preservation of old books and antique glass.

 

 Product features

      Low cost of ownership
      The touch screen display provides in real-time all the main information for excellent process control and rapid analysis
      Able to process up to ten different editable recipes
      Uniformity for Consistent Results
      Datalogging capabilities, frequency <0,5 Hz, for historical condition of the process
      Excellent process control and long term reliability and stability
      Primary brands components used, such as vacuum gauges and mass flow controllers (MKS Instruments)
      RF power level adjustable in the range 1W to 600W

 

 Technical specification
 Dimensions
 W x L x H – Footprint  700 x 600 x 1750 mm
 Net Weight  130 Kg
 ClearancesDistanze di rispetto  Right, Left, Front – 600 mm, Back – 254 mm
  Chamber
 Material
 Aluminum
 Max Volume
 22.5 lt. (1373 in³) - Ø 343 mm L 280 mm
 Electrode  Material
 Aluminum
 Active work area/samle tray  239L x 250P mm
 Height  168 mm
 RF Signal  Max Power
 600W
 Frequency  13,56 MHz
 Process gases
 Available flows  10, 20, 50, 100, 200 or 500 sccm
 Max gases lines
 3 (Mass Flow Controller from MKS Instruments)
 Control interface  Control  PLC
 User Interface  Touch Screen Display
 Facility Service
 Power Supply
 Three-phase + N + Earth 380/415 VAC, 32 Amax 50/60 Hz, 7 AWG
Three-phase + N + Earth 208/240 VAC, 40 Amax, 50/60 Hz, 5 AWG
 Process gas inlets, type and dimensions  6.35 mm (0.25 in.) OD Swagelok®
 Process gas pressure
 from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
 Purge gas inlets, type and dimensions  6.35 mm (0.25 in.) OD Swagelok®
 Suggested purge gas  N2, Air
 Purge gas pressure
 from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
 Pneumatic Valve gas inlets, type and dimensions  6.35 mm (0.25 in.) OD Swagelok®
 Pneumatic Valve gas purity  Compressed Air, Oil Free, Dew point ≤7°C (45°F), particulate dimensions <5 μm
 Pneumatic Valve gas pressure  From 2 bar (30 psig) min. to 6 bar (90 psig) max., regulated
 Exhaust  NW 40 ISO-KF
 Compliance  International  CE Marked